The Role: We are looking for a Senior PCB Design Engineer with strong EDA library ownership and advanced high‑speed board design experience to drive the implementation of our next‑generation data center accelerator platforms . In this role, you will be responsible for the complete PCB design process , from library definition and design rules , through floorplanning, routing, and tape‑out , while collaborating closely with Signal Integrity (SI) and Power Integrity (PI) experts to define layer stacks, PDN strategies, and constraints . This is a hands‑on, technically demanding role focused on very high‑density, high‑layer‑count boards , pushing the limits of power delivery, memory integration, and high‑speed interfaces , using Siemens Xpedition as the primary design environment. Key Responsibilities: · Design and layout complex, high‑layer‑count PCBs for accelerator and data center platforms · Own and maintain EDA libraries (symbols, footprints, padstacks, constraints) · Define routing constraints and complex design rules for high‑speed and high‑power designs · Collaborate with SI/PI teams on layer stack‑ups, impedance control, and PDN design · Collaborate with mechanical and thermal experts to ensure design integration · Drive designs from concept through tape‑out, including manufacturing deliverables · Support DFM reviews, board bring‑up, and hardware debug activities Required Qualifications: · Bachelor’s and Master’s degree in Electrical Engineering or related field. · 5+ years of hands‑on PCB layout experience in complex hardware programs. · Strong experience with Siemens Xpedition (layout and library tools strongly preferred). · Proven background designing high‑speed, high‑layer‑count boards. · Solid understanding of: -Signal Integrity and Power Integrity fundamentals -Controlled impedance routing -High‑density interconnects and advanced packages · Experience creating and maintaining EDA component libraries. · Ability to work effectively with cross‑functional teams (SI, PI, schematic, ME, manufacturing). Preferred Qualifications: · Experience with data‑center, accelerator, networking, or HPC hardware. · Direct involvement in memory subsystem integration and high‑speed serial interfaces. · Familiarity with SI/PI simulation workflows and constraint‑driven design. · Experience defining layer stacks in collaboration with fabricators and SI/PI teams. · Knowledge of DFM/DFT/DFX principles for high‑volume and advanced PCB manufacturing. · Comfortable working in fast‑moving, technically ambitious engineering environments. What do we offer? · Join an innovative team and experience company growth. · We believe in investing in our employees and providing them with the opportunities they need to grow and develop their careers. · Enjoy a hybrid work environment. · We also offer flexible schedule. · We offer a remuneration that values your experience. · The position will have preferably the base in Karlsruhe (Germany). We are looking for outstanding people willing to join our mission to change this industry and help to build a better world. If you feel identified with Openchip, please contact us. We can offer a competitive compensation package in a flexible work schema that will help you to keep a balance between your personal and professional life. At Openchip & Software Technologies S.L., we believe a diverse and inclusive team is the key to groundbreaking ideas. We foster a work environment where everyone feels valued, respected, and empowered to reach their full potential – regardless of race, gender, ethnicity, sexual orientation, or gender identity. Find Jobs in Germany on Arbeitnow